UV Dicing Film

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 Product Characteristics

• High Adhesion

  UV Dicing Film offers strong initial adhesion to secure wafers during the dicing process, ensuring stability and precision.

  
  

• UV-Release Properties

  Designed for efficient UV curing, this film allows easy detachment post-dicing, minimizing residue and simplifying the cleaning process.

  
  

• Clean Cuts

  The film ensures clean and precise cuts, reducing particle generation and preventing damage to delicate wafer edges.

  
  

• Enhanced Yield

  By maintaining wafer integrity and reducing defects, UV Dicing Film contributes to higher product yields and improved operational efficiency.

  
  

• Durability

  Engineered for durability, the film withstands the rigors of the dicing process, providing consistent performance under demanding conditions.

  
  

• Versatility

  Suitable for various semiconductor applications, UV Dicing Film adapts to different wafer sizes and types, offering flexibility in manufacturing processes.

  
  

• Heat Resistance

  The film exhibits excellent heat resistance, ensuring stability and performance even in high-temperature dicing environments.

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 Application Areas

• Semiconductor Manufacturing

  UV Dicing Film is integral in the semiconductor industry, providing precise wafer dicing and ensuring high-quality chip production.

  
  

• Optoelectronics

  In the optoelectronics sector, the film is used to dice wafers for LEDs, laser diodes, and other light-sensitive devices, ensuring clean cuts and minimal damage.

  
  

• Microelectromechanical Systems (MEMS)

  UV Dicing Film is essential in MEMS production, facilitating accurate dicing of micro-scale components and enhancing device reliability.

  
  

• Integrated Circuits (ICs)

  The film supports the dicing of IC wafers, helping to maintain the integrity and performance of integrated circuits used in various electronic devices.

  
  

• Photovoltaic Industry

  Used in the production of solar cells, UV Dicing Film ensures precise cutting of photovoltaic wafers, contributing to the efficiency and durability of solar panels.

  
  

• Advanced Packaging

  In advanced semiconductor packaging, the film aids in the dicing of wafers for flip-chip and 3D packaging, promoting high yield and performance.

  
  

• Compound Semiconductors

  UV Dicing Film is suitable for dicing compound semiconductor wafers, such as those made of GaAs or SiC, which are used in high-frequency and high-power applications.

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 Data Sheet

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 Comment & FAQ

Q: Can our private logo/label be printed on the packaging?

A: Yes, your own private logo/ label can be printed on the packaging upon your legal authorization, we support OEM service according to our clients' requirement for many years.

Q: Why choose us? What are our advantages?

1. Professional adhesive tapes manufacturer for almost 20 years.

2. OEM/ODM AVAILABLE

3. Accept small MOQ

4. Samples available and best service

5. Good production capability and fast delivery

Q: What information need to be provided to get an accurate quotation?

A: We need to know the length, width, thickness and quantity of the product you want to order so that We can provide you with the best price through the information you provide.

Q: What is the lead time?

A: As usual, we will complete the delivery within 10 days after payment approval.

Q: Can you make other sizes and packages for this product?

A: Yes, of course.we can make other sizes as your requirement, normally our quotation will contain the standard package. If you need your own packages,you’d better advise your requirement ahead of time for an accurate quote.